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Good Heat Dissipation Thermal Conductive Silicone Gel Thermal Gap Filler Gel For Telecom Industry

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Good Heat Dissipation Thermal Conductive Silicone Gel Thermal Gap Filler Gel For Telecom Industry

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Brand Name : ZIITEK

Model Number : TIF050-11-1

Certification : UL and RoHs

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 10000/day

Delivery Time : 7-15work days

Packaging Details : 600cc/tube

Product name : Good Heat Dissipation Thermal Conductive Silicone Gel Thermal Gap Filler Gel For Telecom Industry

Keywords : Thermal Conductivity gel

Specific Gravity : 3.25g/cc

Dielectric constant @1MHz : 7.7

Good thermal conductive : 5.0W/mK

Flame Rating : UL 94 V-0

Breakdown Voltage (V/mm) : ≥6000

Color : Dark Gray

Application : Telecom Industry

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Good Heat Dissipation Thermal Conductive Silicone Gel Thermal Gap Filler Gel For Telecom Industry

Company Profile

With professional R&D capabilities and many year experiences in thermal interface material industry, Ziitek company own many unique formulations which are our core technologies and advantages. Our goal is to provide quality & competitive products to our customers worldwide aiming for long-term business cooperation.

Products Description

Ziitek TIF®050-11-1 is recommended for applications that require a minimum amount of pressure on components. The viscoelastic nature of the material also gives excellent low-stress vibration dampening and shock absorbing characteristics. Ziitek TIF®050-11-1 is an electrically isolating material, which allows its use in applications requiring isolation between heat sinks and high-voltage, bare-leaded devices.

Feature

> Thermal conductivity: 5.0 W/mK
> Low stress, protect sensitive components.
> Strong plasticity. good stability
> Superior dielectric properties

Application

> Power module
> LED backlight module, LED lighting
> High speed hardware driver
> Micro heat pipe
> Vihicel enginee controller
> Telecom industry
> Semiconductor automatic laboratory equipment

TIF®050-11-1 Typical Properties
Property Value Test method
Color Dark Gray Visual
Construction & Composition Ceramic filled silicon material -
Density(g/cm³) 3.25g/c ASTM D792
Thermal conductivity 5.0W/mK ASTM D5470
Breakdown Voltage (V/mm) ≥6000 ASTM D149
Dielectric constant @1MHz 7.7 ADTM D150
Flame Rating V-0 UL 94
Volume resistivity(Ohm.cm) 8.0 X 1013 ASTM D257

Product Specification

30 cc/pc, 98 pc/box; 300 cc/pc 6 pc/box

Custom packaging available for automation use. Please contact us for confirming.
If you want to know our thermal products, please visit our website.

Good Heat Dissipation Thermal Conductive Silicone Gel Thermal Gap Filler Gel For Telecom Industry

Independent R&D team

Q: How do I place an order?

A:1. Click the "Sent messages" button to continue with the process.

2. Fill out the message form by entering a subject line, and message to us.

This message should include any questions you might have about the products as well as your purchase requests.

3. Click the "Send" button when you are finished to complete the process and send your message to us.

4. We will reply you as soon as possible with Email or online.

FAQ

Q: Are you trading company or manufacturer ?

A: We are manufacturer in China.

Q: How long is your delivery time?

A: Generally it is 3-7 work days if the goods are in stock. or it is 7-10 work days if the goods are not in stock, it is according to quantity.

Q: Do you offer free samples ?

A: Yes, we are willing to offer free sample.

Q:Is there promotion price for big buyer?

A:Yes, we do have promotion price for big buyer. Please send us email for inquiry.


Product Tags:

thermal conductive silicone gel

      

thermal gap filler gel

      

telecom thermal conductive gel

      
China Good Heat Dissipation Thermal Conductive Silicone Gel Thermal Gap Filler Gel For Telecom Industry wholesale

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