Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules

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Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules

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Specific Gravity 3.0 G/Cc Heat Sink Thermal Gap Pad In Memory Modules

Specific Gravity 3.0 g/cc Heat Sink pad Moldability for Complex Parts for Memory Modules The TIF1200-30-06UF is recommended for applications that require a minimum amount of pressure on components. ...

Product Tags:

3.0 g/cc thermal gap pad

memory modules thermal gap pad

3.0 g/cc thermal interface pad

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